Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Naturally Tacky Needing No Further Adhesive Coating

Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Naturally Tacky Needing No Further Adhesive Coating

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber, Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product description

TIF100-10-01U Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules