1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Products description

The TIF^®100-12-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth, puncture-, tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Features

> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts

Applications

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

> Mass storage devices
> Automotive electronics
> Set top boxes

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.