1.2W/M.K Thermal Pads Silicone Cooling Pad Heat Resistance With Self-Adhesive Films For PC Laptop

1.2W/M.K Thermal Pads Silicone Cooling Pad Heat Resistance With Self-Adhesive Films For PC Laptop

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

The TIF^®112-12-10S-K1 Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive: 1.2W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications

> LED TV / LED Lit Lamps
> Automotive engine control units
> SAD-DC Power Adapters
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Micro heat pipe thermal solutions
> Memory Modules

> Routers

> Telecommunication hardware

> Mainboard/mother board