| Τόπος καταγωγής: | ΚΙΝΑ |
| Μάρκα: | Ziitek |
| Πιστοποίηση: | UL |
| Αριθμό μοντέλου: | TIF050-11-1 |
| Ποσότητα παραγγελίας min: | 1000 σωλήνες |
|---|---|
| Τιμή: | 0.1-100USD/KG |
| Συσκευασία λεπτομέρειες: | 300cc/PCS,6PCS/Box |
| Χρόνος παράδοσης: | 3-8 εργάσιμες ημέρες |
| Όροι πληρωμής: | T/t |
| Δυνατότητα προσφοράς: | 10000KG/Month |
| Όνομα προϊόντων: | Θερμικό τζελ υψηλής αγωγιμότητας 5.0W/MK μονωτικό θερμικό αγώγιμο ζελέ Κατάλληλο για εφαρμογές PCB | Ειδική βαρύτητα: | 30,25 g/cc |
|---|---|---|---|
| Χρώμα: | Σκούρο γκρι | Υλικό υλικό: | Κηραμικό υλικό γεμάτο πυρίτιο |
| Τάση βλάβης (V/mm): | ≥6000 | Θερμική αγωγιμότητα: | 5.0W/m-Κ |
| Λέξη -κλειδί: | Θερμικό τζελ | Εφαρμογή: | Εφαρμογές PCB |
| Η διηλεκτρική σταθερά @ 1MHz: | 7.7 |
High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability, effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application environments.
Feature
> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties
Application
> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIF®050-11-1 Typical Properties | ||
| Property | Value | Test method |
| Color | Dark Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ****** |
| Density(g/cm³) | 3.25g/c | ASTM D792 |
| Thermal conductivity | 5.0W/mK | ASTM D5470 |
| Breakdown Voltage (V/mm) | ≥6000 | ASTM D149 |
| Dielectric constant @1MHz | 7.7 | ADTM D150 |
| Flame Rating | V-0 | UL 94 |
| Volume resistivity(Ohm.cm) | 8.0 X 1013 | ASTM D257 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Υπεύθυνος Επικοινωνίας: Dana Dai
Τηλ.:: +86 18153789196