Name: Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-32-05U
Price: 4.10 USD
Availability: InStock

Αρχική Σελίδα Προϊόντα θερμικό μαξιλάρι σιλικόνης

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Λεπτομέρειες:

Τόπος καταγωγής:	Κίνα
Μάρκα:	Ziitek
Πιστοποίηση:	UL & RoHS
Αριθμό μοντέλου:	TIF100-32-05U

Πληρωμής & Αποστολής Όροι:

Ποσότητα παραγγελίας min:	1000 τεμ
Τιμή:	0.1-10 USD/PCS
Συσκευασία λεπτομέρειες:	Κουτιά 242312cm
Χρόνος παράδοσης:	3-5 εργάσιμες
Όροι πληρωμής:	T/T
Δυνατότητα προσφοράς:	1000000 pcs/μήνα

Επικοινωνία

Λεπτομερής Περιγραφή Προϊόντος

Όνομα προϊόντων:	Εξαιρετικά μαλακό θερμικό επίθεμα σιλικόνης 3,2 W Υψηλής αγωγιμότητας Γέμισμα για διακομιστές AI, ψύ	Εύρος πάχους:	0,25-5,0mmT
Εφαρμογή:	Διακομιστές AI, Ψύξη GPU, Μετατροπέας	Χρώμα:	Μπλε
Τάση διάσπασης (V/mm)):	≥5500	Κατασκευή:	Ελαστομερές σιλικόνης γεμάτης κεραμικά
Βαθμολογία πυρκαγιάς:	UL94 V-0	Θερμική αγωγιμότητα:	3.2W/m-Κ
Η διηλεκτρική σταθερά @ 1MHz:	3.5	Λέξεις-κλειδιά:	Θερμικά μαξιλαράκι σιλικόνης

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.

Features:

> Good thermal conductivity: 3.2W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability

Applications

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

Typical Properties of TIF^®100-32-05U Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020 (0.25~0.5)	0.030~0.200 (0.75~5.0)	ASTM D374
Hardness (Shore OO)	65	27	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	3.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.2 W/m-K		ASTM D5470
	3.2 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010"(0.25 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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