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Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Λεπτομέρειες:
Τόπος καταγωγής: Κίνα
Μάρκα: Ziitek
Πιστοποίηση: UL & RoHS
Αριθμό μοντέλου: TIF700PU
Πληρωμής & Αποστολής Όροι:
Ποσότητα παραγγελίας min: 1000 τεμ
Τιμή: 0.1-10 USD/PCS
Συσκευασία λεπτομέρειες: Κουτιά 24*23*12cm
Χρόνος παράδοσης: 3-5 εργάσιμες
Όροι πληρωμής: T/T
Δυνατότητα προσφοράς: 1000000 pcs/μήνα
Επικοινωνία
Λεπτομερής Περιγραφή Προϊόντος
Όνομα προϊόντων: CPU πολλαπλού πάχους Υψηλής θερμικής αγωγιμότητας Θερμικό επίθεμα πυριτίου κοπής με μήτρα για διακομ Θερμική αγωγιμότητα: 7.5W/m-K
Εφαρμογή: Διακομιστές AI Επεξεργαστές AI Εύρος πάχους: 0,5-5,0mmT
Λέξεις-κλειδιά: θερμικό μαξιλάρι σιλικόνης Η διηλεκτρική σταθερά @ 1MHz: 4.5
Χρώμα: Γκρί Τάση διάσπασης (V/mm)): ≥5500
Βαθμολογία πυρκαγιάς: UL94 V-0 Κατασκευή: Ελαστομερές σιλικόνης γεμάτης κεραμικά

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

 

 Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®700PU Series an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

 

Features

> Excellent thermal conductivity:7.5 W/mK
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

 

Typical Properties of TIF®700PU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.5)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 70 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007

 

Product Specifications

Standard Thickness:0.02" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (203 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronical Material and Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: +86 18153789196

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