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Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

Λεπτομέρειες:
Τόπος καταγωγής: Κίνα
Μάρκα: Ziitek
Πιστοποίηση: UL
Αριθμό μοντέλου: TIF100-65-11U
Πληρωμής & Αποστολής Όροι:
Ποσότητα παραγγελίας min: 1000 ΤΕΜ
Τιμή: 0.1-10 USD/PCS
Συσκευασία λεπτομέρειες: 25*13*12cm κουτί
Χρόνος παράδοσης: 3-8 εργάσιμες ημέρες
Όροι πληρωμής: T/T
Δυνατότητα προσφοράς: 100000 τμχ/μήνα
Επικοινωνία
Λεπτομερής Περιγραφή Προϊόντος
Όνομα προϊόντων: Εξαιρετική βαθμολογία θερμικής αγωγιμότητας 10,0 W/MK Βασισμένο σε σιλικόνη Θερμικό Pad Filler για Δ Θερμική αγωγιμότητα: 6.5W/mK
Εφαρμογή: AI Processors Διακομιστές AI Τάση βλάβης (V/mm): ≥5500
Χρώμα: Μπλε Κατασκευή: Κεραμικό ελαστομερές σιλικόνης
Πυκνότητα(g/cm³): 3.4 Λέξη-κλειδί: Θερμικό Pad Gap
Σκληρότητα: 65/27 Shore 00

Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

The TIF®100-65-11U Series is designed for high performance applications and provides excellent wet-out at the interface, due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offer high thermal performance at low pressures.

 

> Thermal conductivity: 6.5W/m-K
> ​Ultra-low modulus design easily conforms and adheres to irregular surfaces
> ​Low compression stress
> ​High compliance, low compression stress
> ​Supplied with protective liners for ease of use

 
 
Applications
 
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> CPU
> Display card
> Mainboard/mother board
 
Typical Properties of TIF®100-65-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer  -
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃  -
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5W/m-K ASTM D5470
6.5W/m-K ISO22007

 
Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

 

Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Exceptional Thermal Conductivity Rating Of 10.0W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronical Material and Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: +86 18153789196

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