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Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling

Ultra-Soft 10W/mK Thermal Pad with Ceramic Filled Silicone for High-End Chip Cooling

Λεπτομέρειες:
Τόπος καταγωγής: Κίνα
Μάρκα: Ziitek
Πιστοποίηση: UL and RoHs
Αριθμό μοντέλου: TIF100 10020-11
Έγγραφο: TIF100 10020-11_Data Sheet.pdf
Πληρωμής & Αποστολής Όροι:
Ποσότητα παραγγελίας min: 1000 τεμ
Τιμή: 0.1-10 USD/PCS
Συσκευασία λεπτομέρειες: Κουτί 24*13*12cm
Χρόνος παράδοσης: 3-8 εργάσιμες ημέρες
Όροι πληρωμής: T/T
Δυνατότητα προσφοράς: 100000 τμχ/μήνα
Επικοινωνία
Λεπτομερής Περιγραφή Προϊόντος
Όνομα προϊόντων: Εξαιρετικής απόδοσης 10W/mK Θερμικό επίθεμα αποτελεσματικής πλήρωσης κενών για τσιπ υψηλής ποιότητας θερμικός αγώγιμος: 10.0W/mK
Σκληρότητα: 20 ακτή 00 δείγμα: Δωρεάν δείγμα
Χρώμα: Σκούρο γκρι Πάχος: 0,012"~0,200"/(0,30~5,0mm)
Πυκνότητα: 3,3 g/cm³ Λέξεις-κλειδιά: Θερμικό επίθεμα σιλικόνης
Κατασκευή: Κεραμικό ελαστομερές σιλικόνης Εφαρμογή: High-end Chip

Ultra Performance 10W/mK Thermal Pad Effectively Fill Gaps Pad For High-end Chip
Product Description
The TIF®100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision assemblies, including large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.
Features
  • Excellent thermal conductivity 10.0W/mK
  • Super soft and highly compliant
  • Self-adhesive without the need for additional surface adhesives
  • High insulation performance
Applications
  • AI Servers
  • Semiconductor Packaging
  • Low-Altitude Aircraft
  • Optical Communication Products
  • 5G Base Stations
Typical Properties of TIF®100 10020-11 Series
Property Value Test Method
Color Dark White Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.012~0.020 | 0.030~0.200
0.30~0.50 | 0.75~5.0
ASTM D374
Hardness (Shroe 00) 20 | 20 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.4 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 10.0W/m-K
10.0 W/m-K
ASTM D5470
ISO22007
Product Specifications
Standard Thickness: 0.012" (0.30 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"x16" (406 mm x 406 mm)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
TIF Series Thermal Pad Product Image
Packaging Details & Lead Time
Packaging of Thermal Pad:
  • With PET film or foam for protection
  • Use paper card to separate each layer
  • Export carton inside and outside
  • Meet with customers' requirement - customized
Lead Time:
Quantity (Pieces): 5000
Est. Time (days): To be negotiated
Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies
Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste, thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel, silicone foam, silicone-free thermal pads etc. We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.
Ziitek Culture
Quality: Do it right the first time, total quality control
Effectiveness: Work precisely and thoroughly for effectiveness
Service: Quick response, on time delivery and excellent service
Team Work: Complete teamwork, including sales team, marketing team, engineering team, R&D team, manufacturing team, logistics team. All is for supporting and servicing a satisfying service for customers.
Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronical Material and Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: +86 18153789196

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