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Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware

Λεπτομέρειες:
Τόπος καταγωγής: Κίνα
Μάρκα: Ziitek
Πιστοποίηση: UL and RoHs
Αριθμό μοντέλου: ΤΙΦ100-50-11F
Έγγραφο: TIF100-50-11F_Data Sheet.pdf
Πληρωμής & Αποστολής Όροι:
Ποσότητα παραγγελίας min: 1000 τεμ
Τιμή: 0.1-10 USD/PCS
Συσκευασία λεπτομέρειες: Κουτί 24*13*12cm
Χρόνος παράδοσης: 3-8 εργάσιμες ημέρες
Όροι πληρωμής: T/T
Δυνατότητα προσφοράς: 100000 τμχ/μήνα
Επικοινωνία
Λεπτομερής Περιγραφή Προϊόντος
Όνομα προϊόντων: Σκούρο γκρι Thermal Gap Filler Pads σιλικόνης με 5,0 W/mK Υψηλή θερμική αγωγιμότητα για αποτελεσματι θερμικός αγώγιμος: 5,0 W/mK
Κατασκευή: Κεραμικό ελαστομερές σιλικόνης Σκληρότητα: 65/60 Shore 00
δείγμα: Δωρεάν δείγμα Χρώμα: σκούρο γκρι
Πάχος: 0.010 "(0.25mm) ~ 0.200" (5.0mm) Πυκνότητα: 3,3 g/cm³
Λέξεις-κλειδιά: Τακάκια σιλικόνης Thermal Gap Filler Εφαρμογή: Για αποτελεσματική μεταφορά θερμότητας σε υλικό τηλεπικοινωνιών

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware

Company Profile 

Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description


The TIF®100-50-11F  Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.


Features

> Good thermal conductive 6.5W/mK
> Broad range of hardnesses available
> Outstanding thermal performance
> Available in varies thicknesses
> Outstanding thermal performance
> Soft and compressible for low stress applications

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules 
> Mass storage devices 
> Automotive electronics 
> Set top boxes 
> Audio and video component

Key attributes 


Typical Properties of TIF®100-50-11F Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.5 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 5.0 ASTM D5470
5.0 ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Dark Gray Thermal Gap Filler Silicone Pads With 5.0W/mK High Thermal Conductivity For Effective Heat Transfer In Telecommunication Hardware 1


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1


Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us. 


Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.  


Q: How to find a right thermal conductivity for my applications 

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. 

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronical Material and Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: +86 18153789196

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